(5/5) based on 3 customer reviews
Description
MAX31865AAP +T. -40 C to +125 C. 20 SSOP. MAX31865ATP+. -40 C to +125 C. 20 TQFN-EP*. MAX31865ATP+T. -40 C to +125 C. 20 TQFN-EP*. PACKAGE. Product Content Information for: MAX31865AAP +T. Links. Qualifications. Package Description. Chemical Composition Summary. Detailed Package Component High Endurance Non-volatile Memory segments. 32Kbytes of In-System Self- programmable Flash program memory. 1024Bytes EEPROM. 2Kbytes Internal -40 C +125 C2. 0 SSOP. MAX31865AAP +T -40 C +125 C2. 0 SSOP. MAX31865ATP+. -40 C +125 C2. 0 TQFN-EP*. MAX31865ATP+T. -40 C + 125 C2. MAX31865AAP +T. -40 C to +125 C. 20 SSOP. MAX31865ATP+. -40 C to +125 C. 20 TQFN-EP*. MAX31865ATP+T. -40 C to +125 C. 20 TQFN-EP*. .
| Part Number | MAX31865AAP |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | PMIC - Thermal Management |
| Brand | Intel |
| Description | IC RTD TO DIGITAL CONVERT 20SSOP |
| Series | - |
| Packaging | Tube |
| Function | Temp Monitoring System (Sensor) |
| Sensor Type | External |
| Sensing Temperature | - |
| Accuracy | ±0.5°C(Max) |
| Topology | ADC (Sigma Delta), Comparator, Register Bank |
| Output Type | SPI |
| Output Alarm | No |
| Output Fan | No |
| Voltage - Supply | 3 V ~ 3.6 V |
| Operating Temperature | -40°C ~ 125°C |
| Mounting Type | Surface Mount |
| Package / Case | 20-SSOP (0.209", 5.30mm Width) |
| Supplier Device Package | 20-SSOP |
| Image |  |
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